design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. e 1 r 2 j 3 3 4 g 5 e 6 y 7 j 8 1 9 0 10 2 11 v 12 thick film chip resistors product code size, power rating 1ge : 0201 2ge : 0402 3ge : 0603 6ge : 0805 8ge : 1206 14 : 1210 12 : 1812 12z : 2010 1t : 2512 0.05 w 0.063 w 0.1 w 0.125 w 0.25 w 0.25 w 0.5 w 0.5 w 1w power r. marking code y ] nil marking value marking on black side no marking resistance tolerance code j 0 tolerance 5% jumper the first two digits are significant figures of resistance and the third one denotes number of zeros following. decimal point is expressed by r as 4.7 = 4r7. jumper is expressed by r00. resistance value packaging methods code v u b x y c packaging
punched (paper) taping (only 3g, 6g, 8g type) embossed taping (only 14, 12, 12z, 1t type) bulk case (only 2g, 3g, 6g type) punched (paper) taping 2 mm pitch, 10000 pcs. (only 2g, 3g type) punched (paper) taping 2 mm pitch, 20000 pcs. (only 2g type) punched (paper) taping 2 mm pitch, 15000 pcs. (only 1g type) type : inches thick film chip resistors thick film chip resistors 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 type: erj 1g, 2g, 3g, 6g, 8g, 14, 12, 12z, 1t n features l small size and lightweight for pcb size reduction and lightweight products l high reliability metal glaze thick film resistive element and three layers of electrodes result in high reliability l matching with placement machine taping and bulk case packagings for automatic placement machine l solderability suitable for both reflow soldering and flow soldering l reference standards iec 60115-8, jis c 5201-8, eiaj rc-2134a n explanation of part numbers ] when omitted, all the rest p/n factors shall be moved up respectively.
design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. erj1g 0.60 0.03 0.30 0.03 0.12 0.05 0.15 0.05 0.25 0.05 0.15 g (0201) erj2g 1.00 0.05 0.50 0.05 0.20 0.10 0.25 0.05 0.35 0.05 0.8 g (0402) erj3g 1.60 0.15 0.80 +0.15 0.30 0.20 0.30 0.15 0.45 0.10 2g (0603) e0.05 erj6g 2.00 0.20 1.25 0.10 0.40 0.20 0.40 0.20 0.60 0.10 4g (0805) erj8g 3.20 +0.05 1.60 +0.05 0.50 0.20 0.50 0.20 0.60 0.10 10 g (1206) erj14 3.20 0.20 2.50 0.20 0.50 0.20 0.50 0.20 0.60 0.10 16 g (1210) ERJ12 4.50 0.20 3.20 0.20 0.50 0.20 0.50 0.20 0.60 0.10 27 g (1812) ERJ12z 5.00 0.20 2.50 0.20 0.60 0.20 0.60 0.20 0.60 0.10 27 g (2010) erj1t 6.40 0.20 3.20 0.20 0.65 0.20 0.60 0.20 0.60 0.10 45 g (2512) (1) rated continuous working voltage (rcwv) shall be determined from rcwv= power rating resistance values, or limiting element voltage (max. rcwv) listed above, whichever less. (2) overload (short-time overload) test voltage (sotv) shall be determined from sotv=2.5 power rating or max. overload voltage listed above whichever less. n construction n dimensions in mm (not to scale) thick film chip resistors n ratings a b t w l ? type (inches) power rating at 70 ?c (w) limiting element voltage (maximum rcwv) (1) (v) maximum overload voltage (2) (v) resistance tolerance(%) standard resistance values min. max. resistance range ( w ) t.c.r. 10 -6 /?c (ppm/?c) jumper 1g 2g 3g 6g8g141212z1t maximum overload current 1a 2a 4a rated current 0.5 a 1 a 2 a dimensions (mm) lwa b t weight (1000 pcs.) type (inches) e0.20 e0.15 erj1g (0201) erj2g (0402) erj3g (0603) erj6g (0805) erj8g (1206) erj14 (1210) ERJ12, 12z (1812, 2010) erj1t (2512) < 10 w: e100 to +600 0.05 0.063 0.1 0.125 0.25 0.25 0.5 1 15 50 50 150 200 200 200 200 30 100 100 200 400 400 400 400 5 5 5 5 5 5 5 5 10 1 1 1 1 1 1 1 1 m 2.2 m 10 m 10 m 10 m 10 m 10 m 1 m e24 e24 e24 e24 e24 e24 e24 e24 10 w to 1m w: 200 1m w<: e400 to +150 protective coating high purity alumina substrate termination (inner) termination (between) resistive element termination (outer) power derating curve for resistors operated in ambient temperatures above 70 ?c, power rating shall be derated in accordance with the right figure. e40 e20 0 20 40 60 80 100 120 140 160 0 180 e60 155 ?c 70 ?c ambient temperature (?c) 20 40 60 80 100 rated load (%) e55 ?c 3g, 6g, 8g 1g,2g,14,12,12z,1t 125 ?c
design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. erj1g 0.25 15000 pcs./reel (2 mm pitch) (0201) erj2g 0.35 10000 pcs./reel (2 mm pitch) 50000 pcs./case (0402) 20000 pcs./reel (2 mm pitch) erj3g 0.45 10000 pcs./reel (2 mm pitch) 25000 pcs./case (0603) 5000 pcs./reel (4 mm pitch) ] erj6g 0.6 5000 pcs./reel (4 mm pitch) ] 10000 pcs./case (0805) erj8g 0.6 5000 pcs./reel (4 mm pitch) ] (1206) erj14 0.6 5000 pcs./reel (1210) ERJ12,12z 0.6 5000 pcs./reel (1812,2010) erj1t 0.6 4000 pcs./reel (2512) 180.0 e3.0 60 min. 13.0 1.0 1g,2g,3g 6g,8g,14 12,12z,1t 13.0 1.0 15.4 2.0 thick film chip resistors n packaging methods l standard quantity l taping reel type f a f b f cw t 9.0 1.0 11.4 2.0 0 l bulk case f b w t f a f c slider shutter 110 38 12 dimensions (mm) (mm) punched (paper) taping embossed taping (4 mm pitch) bulk case type (inches) thickness (mm) ] please ask us when resistors except standard specification shown above talde are needed. 1g 0.47 0.05 2g 2.00 0.10 0.52 0.05 3g 0.70 0.05 6g 4.00 0.10 8g 14 2.80 0.20 3.50 0.20 8.00 0.30 3.50 0.05 12 3.50 0.20 4.80 0.20 12z 2.80 0.20 5.30 0.20 12.00 0.30 5.50 0.05 1.75 0.10 4.00 0.10 1t 3.60 0.20 6.90 0.20 l punched (paper) taping f e w p 1 p 2 p 0 t a b tape running direction chip component sprocket hole compartment f d 0 14 1 min. 12 12z 2.00 0.05 4.00 0.10 1.50 +0.10 1.00 0.10 1.5 min. 1t l embossed taping type abwfep 1 dimensions (mm) type p 2 p 0 f d 0 t f d 1 dimensions (mm) 0 fe w f d 1 p 1 p 2 p 0 t a b tape running direction chip component sprocket hole compartment f d 0 type abwfe 1g 0.38 0.05 0.68 0.05 2g 0.70 0.05 1.20 0.05 3g 1.10 0.10 1.90 0.10 6g 1.65 0.15 2.50 0.20 8g 2.00 0.15 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 dimensions (mm) type p 1 p 2 p 0 f d 0 t 2.00 0.05 4.00 0.10 1.50 +0.10 0.84 0.05 dimensions (mm) 0
design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. erj1g(0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 erj2g(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 erj3g(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 erj6g(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 erj8g(1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 erj14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 ERJ12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 ERJ12z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 erj1t(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 thick film chip resistors n recommended land pattern in the case of flow soldering, the land width must be smaller than the chip resistor width to control the solder amount properly. generally, the land width should be 0.7 to 0.8 times (w) of the width of chip resistor. in the case of reflow solderi ng, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (w). 1. if transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with the resistors actually mounted on your own board. when the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. never exceed the rated power. 2. chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. 3. when soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. when using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less up to 350 ?c). 4. avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistor?s performance. chip resistor c a b type (inches) dimensions (mm) abc cautions for safety n recommended soldering conditions recommendations and precautions are described below. preheating peak heating temperature time l recommended soldering conditions for reflow reflow soldering shall be two times maximum. please contact us for additional information when you use in conditions other than those specified. please measure a temperature of terminations and study solderability every kind of solder and board, before actual use. temperature time preheating 140 ?c to 160 ?c 60 s to 120 s main heating above 200 ?c 30 s to 40 s peak 235 5 ?c max. 10 s temperature time preheating 150 ?c to 180 ?c 60 s to 120 s main heating above 230 ?c 30 s to 40 s peak max. 260 ?c max. 10 s for solder (example : sn/pb) for lead-free solder (example : sn/ag/cu) l recommended soldering conditions for flow for solder for lead-free solder temperature time temperature time preheating 140 ?c to 160 ?c 60 s to 120 s 150 ?c to 180 ?c 60 s to 120 s soldering 2455 ?c 20 s to 30 s max. 260 ?c max. 10 s
|
